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Patent Searching and Data


Title:
PHOTOCURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/007566
Kind Code:
A1
Abstract:
Disclosed is a photocurable resin composition which comprises a photopolymerization initiator having two oxime ester groups in the molecule, a resin containing a carboxyl group, and a compound having two or more ethylenically unsaturated groups in the molecule. The composition can achieve high sensitivity, can provide a dried coating film having excellent touch dryness of fingers, can prevent the generation of an out gas during curing or the like, and can achieve all of excellent alignment accuracy, high productivity and high reliability in the formation of a solder resist for a printed wiring board or the like.

Inventors:
SHIBASAKI, Yoko (C/O TAIYO INK MFG, CO. LTD., Ranzan Facility, 388, Oaza Okura, Ranzanmachi, Hiki-gu, Saitama 22, 〒3550222, JP)
柴崎 陽子 (〒22 埼玉県比企郡嵐山町大字大蔵388番地太陽インキ製造株式会社 嵐山事業所内 Saitama, 〒3550222, JP)
Application Number:
JP2010/004572
Publication Date:
January 20, 2011
Filing Date:
July 14, 2010
Export Citation:
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Assignee:
TAIYO HOLDINGS CO., LTD. (7-1 Hazawa 2-chome, Nerima-ku Tokyo, 08, 〒1768508, JP)
太陽ホールディングス株式会社 (〒08 東京都練馬区羽沢二丁目7番1号 Tokyo, 〒1768508, JP)
SHIBASAKI, Yoko (C/O TAIYO INK MFG, CO. LTD., Ranzan Facility, 388, Oaza Okura, Ranzanmachi, Hiki-gu, Saitama 22, 〒3550222, JP)
International Classes:
G03F7/031; C08F2/50; G03F7/004; H05K3/28
Foreign References:
JP2007197340A2007-08-09
JP2005097141A2005-04-14
JP2007197390A2007-08-09
JP4344400B12009-10-14
Attorney, Agent or Firm:
AMAGI INTERNATIONAL PATENT LAW OFFICE (SOLID SQUARE EAST TOWER 4F, 580 Horikawa-cho,Saiwai-ku, Kawasaki-shi, Kanagawa 13, 〒2120013, JP)
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