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Patent Searching and Data


Title:
PHOTOCURABLE RESIN COMPOSITIONS
Document Type and Number:
WIPO Patent Application WO/2001/055790
Kind Code:
A1
Abstract:
A photocurable resin composition which comprises a resin having hydroxyl groups and polymerizable unsaturated groups, a photopolymerization initiator, and a photopolymerizable monomer; and a method of molding PDP ribs from the photocurable resin composition which further contains a diluting solvent. Also provided are: a liquid photoresist resin composition for printed circuit boards which is obtained by incorporating an organic solvent and/or a polymerizable vinyl monomer into a modified copolymer obtained through the addition reaction of an alicyclic epoxidized ethylenic compound with a carboxylated resin obtained by polymerizing a monomer ingredient comprising a carboxylated ethylenic compound as an essential monomer; and a photocurable resin composition comprising the photoresist resin composition and a composition of carboxyl-terminated monomers obtained by the modification with an acid anhydride of hydroxyl-terminated acrylates formed by causing 1 mol of a hydroxyalkyl (meth)acrylate to add 0.3 to less than 1 mol of $g(e)-caprolactone on the average.

Inventors:
MIYAKE HIROTO (JP)
MARUO KATSUYA (JP)
OKITSU KIYOSHI (JP)
Application Number:
PCT/JP2001/000459
Publication Date:
August 02, 2001
Filing Date:
January 24, 2001
Export Citation:
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Assignee:
DAICEL CHEM (JP)
MIYAKE HIROTO (JP)
MARUO KATSUYA (JP)
OKITSU KIYOSHI (JP)
International Classes:
G03F7/00; G03F7/004; G03F7/027; G03F7/032; G03F7/033; G03F7/035; (IPC1-7): G03F7/027; C08F290/06; C08F2/50; G03F7/004; G02B5/20
Foreign References:
JPH11311858A1999-11-09
JPH11228640A1999-08-24
JPH07242716A1995-09-19
JPH10300923A1998-11-13
JPH11258793A1999-09-24
JPH11249303A1999-09-17
JPS60101531A1985-06-05
JPH08211596A1996-08-20
JPH11149153A1999-06-02
Other References:
See also references of EP 1172693A4
Attorney, Agent or Firm:
Miura, Yoshikazu (Kojimachi 4, Kojimachi 5-chome Chiyoda-ku Tokyo, JP)
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