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Title:
PHOTOCURABLE THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF SAME, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2016/136755
Kind Code:
A1
Abstract:
Provided are: a photocurable thermosetting resin composition which has both excellent sensitivity and excellent solder heat resistance; a cured product of this photocurable thermosetting resin composition; and a printed wiring board. A photocurable thermosetting resin composition which contains a carboxyl group-containing photosensitive organic-inorganic hybrid resin varnish (A), a photopolymerization initiator (B) and an organic nitrogen compound (C). The carboxyl group-containing photosensitive organic-inorganic hybrid resin varnish (A) is obtained by having a compound (A-2) partially react with a hydroxyl group of a photosensitive resin (A-1) containing a carboxyl group. The photosensitive resin (A-1) is obtained by having an unsaturated monocarboxylic acid (a2) react with an epoxy group of a polyfunctional epoxy resin (a1), and then having the reaction product react with a polybasic acid anhydride (a3) so that some of hydroxyl groups remain therein. The compound (A-2) is obtained by subjecting silane compounds including at least one silane compound having a (meth)acryloyl group to a hydrolysis-condensation reaction.

Inventors:
INAGAKI SHOJI (JP)
Application Number:
PCT/JP2016/055292
Publication Date:
September 01, 2016
Filing Date:
February 23, 2016
Export Citation:
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Assignee:
TAIYO HOLDINGS CO LTD (JP)
International Classes:
G03F7/075; G03F7/004; G03F7/027; H05K3/28
Foreign References:
JP2003195499A2003-07-09
JPH10161315A1998-06-19
JP2007093801A2007-04-12
JPH0619134A1994-01-28
JP2008165180A2008-07-17
JPH11327150A1999-11-26
JPH11279243A1999-10-12
JP2002138140A2002-05-14
JP2000017152A2000-01-18
JP2007140274A2007-06-07
JPH02169602A1990-06-29
JP2007056151A2007-03-08
JPH10282666A1998-10-23
JP2006171279A2006-06-29
JP2007153978A2007-06-21
JP2009003369A2009-01-08
Attorney, Agent or Firm:
HONDA ICHIRO (JP)
Ichiro Honda (JP)
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