PHOTODETECTOR CHIP, OPTICAL RECEIVING AND TRANSCEIVER ASSEMBLY, OPTICAL MODULE AND COMMUNICATION EQUIPMENT

WIPO Patent Application WO/2020/087328

A1

Provided by the embodiments of the present invention is a photodetector chip, which comprises a substrate, a semiconductor optical amplifier part and a photoelectric detection part, the substrate comprising a surface; the photoelectric detection part and the semiconductor optical amplifier part are arranged on the surface of the substrate, and the photoelectric detection part is located in a light output direction of the semiconductor optical amplifier part and the semiconductor optical amplifier part; the semiconductor optical amplifier part amplifies and filters an inputted optical signal and outputs the amplified and filtered optical signal to the photoelectric detection part; the photoelectric detection part is used for converting the amplified and filtered optical signal into an electrical signal; the semiconductor optical amplifier part comprises a grating, the grating comprises a first grating and a second grating in a cascade, and the first grating is an inclined grating; the first grating and the second grating are used to filter the optical signal which enters the semiconductor optical amplifier part, so that a wave of a specific frequency band passes while the waves of other frequency bands are shielded.

CHENG YUANBING (CN)
WANG HENG (CN)
DAI JING (CN)
DONG YINGHUA (CN)

PCT/CN2018/112927

May 07, 2020

October 31, 2018

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HUAWEI TECH CO LTD (CN)

H04B10/25; G02B6/42; H04J14/02

CN107566045A	2018-01-09
CN103248447A	2013-08-14
CN101222121A	2008-07-16
CN102369676A	2012-03-07

SCIHEAD IP LAW FIRM (CN)

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