PHOTOELECTRIC MIXED SUBSTRATE, CONNECTOR KIT, AND METHOD FOR MANUFACTURING SAME

Title:

PHOTOELECTRIC MIXED SUBSTRATE, CONNECTOR KIT, AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2019/187020

Kind Code:

A1

Abstract:

This photoelectric mixed substrate can be mounted to a connector provided with a bottom wall. The photoelectric mixed substrate is provided with an optical waveguide and an electrical circuit board in this order toward one side in the thickness direction thereof. The optical waveguide is provided with: an underclad layer; a core layer disposed on one surface of the underclad layer; and an overclad layer disposed on one surface of the underclad layer so as to cover the core layer. The underclad layer is in contact with the other surface of the electrical circuit board in the thickness direction. The one surface of the electrical circuit board in the thickness direction can be placed on the bottom wall.

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Inventors:

TANAKA NAOYUKI (JP)
TSUJITA YUICHI (JP)

Application Number:

PCT/JP2018/013651

Publication Date:

October 03, 2019

Filing Date:

March 30, 2018

Export Citation:

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Assignee:

NITTO DENKO CORP (JP)

International Classes:

G02B6/36; G02B6/122; H01R13/46

Domestic Patent References:

WO2016047447A1	2016-03-31
WO2017179485A1	2017-10-19

Foreign References:

JP2014211510A	2014-11-13
JP2014157263A	2014-08-28
JP2014219536A	2014-11-20
US20120163752A1	2012-06-28

Attorney, Agent or Firm:

OKAMOTO, Hiroyuki et al. (JP)

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