PHOTOELECTRIC WIRING BOARD, OPTICAL COMMUNICATION DEVICE AND METHOD FOR MANUFACTURING OPTICAL COMMUNICATION DEVICE

Title:

PHOTOELECTRIC WIRING BOARD, OPTICAL COMMUNICATION DEVICE AND METHOD FOR MANUFACTURING OPTICAL COMMUNICATION DEVICE

Document Type and Number:

WIPO Patent Application WO/2007/111236

Kind Code:

A1

Abstract:

A photoelectric wiring board and an optical communication device applicable to a large information processing capacity and high-speed information processing are provided by using a flex rigid substrate. An optical waveguide is provided with rigid sections (50a, 50c) wherein a conductor circuit and an insulating layer are laminated on the both sides of the substrate; a flexible flex section (50b); and a flex-rigid substrate section (2) whereupon an electric wiring is arranged. The optical waveguide (34), which has end planes (35a, 35c) substantially vertical to the optical waveguide and bends with the flex section (50b), is fixed on the rigid sections (50a, 50c) in optical element mounting regions (2a, 2c) arranged on the rigid sections (50a, 50c), with its end planes (35a, 35c) facing each other.

Inventors:

KODAMA HIROAKI (JP)
CHEN LIYI (JP)
NAKASHIMA KENSAKU (JP)

Application Number:

PCT/JP2007/055967

Publication Date:

October 04, 2007

Filing Date:

March 23, 2007

Export Citation:

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Assignee:

IBIDEN CO LTD (JP)
KODAMA HIROAKI (JP)
CHEN LIYI (JP)
NAKASHIMA KENSAKU (JP)

International Classes:

G02B6/122; G02B6/42; H05K1/02; H05K3/46

Foreign References:

JP2006042307A	2006-02-09
JPH06268339A	1994-09-22
JP2004206015A	2004-07-22
JP2000039531A	2000-02-08
JP2003014972A	2003-01-15
JPH06268339A	1994-09-22
JP2002331532A	2002-11-19
JP2003014972A	2003-01-15

Other References: