Title:
PHOTOELECTRIC WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/180785
Kind Code:
A1
Abstract:
This photoelectric wiring substrate comprises: an insulating substrate having a first surface including a mounting area for semiconductor elements; a connection terminal arranged inside a first surface mounting area and to which semiconductor elements are connectable; optical wiring arranged upon the first surface and having an optical modulator including a first electrode arranged on the first surface, a core section comprising an electro-optical polymer material and arranged upon the first electrode, and a second electrode arranged upon part of the core section and being electrically connected to the connection terminal; and a first conductor arranged inside the insulating substrate and overlapping the optical modulator in the planar view. As a result, connection loss between an optical waveguide path and the optical modulator in the optical wiring can be reduced.
Inventors:
ASAI SATOSHI (JP)
MATSUBARA TAKAHIRO (JP)
MATSUBARA TAKAHIRO (JP)
Application Number:
PCT/JP2018/011065
Publication Date:
October 04, 2018
Filing Date:
March 20, 2018
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
G02B6/125; G02F1/035
Domestic Patent References:
| WO2010004850A1 | 2010-01-14 |
Foreign References:
| US20140376857A1 | 2014-12-25 | |||
| JP2012078375A | 2012-04-19 | |||
| JP2015184588A | 2015-10-22 | |||
| JP2010211179A | 2010-09-24 |
Attorney, Agent or Firm:
SAIKYO, Keiichiro (JP)
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