PHOTOHARDENING MOLDING APPARATUS WITH IMPROVED RECOATING PROCESS AND PHOTOHARDENING MOLDING METHOD

Title:

PHOTOHARDENING MOLDING APPARATUS WITH IMPROVED RECOATING PROCESS AND PHOTOHARDENING MOLDING METHOD

Document Type and Number:

WIPO Patent Application WO/1993/024303

Kind Code:

A1

Abstract:

A photohardening molding apparatus and a photohardening molding method, wherein the reliability of an operation for coating the upper surface of a hardened layer with an unhardened liquid is improved and the time required to carry out the same operation is reduced. To meet the purpose, a clearance shall be formed between the lower surface of a recoater travelling on a hardened layer and the upper surface of the hardened layer. When this condition is satisfied, an unhardened liquid is introduced onto the hardened layer owing to both the force of the lower surface of the recoater of dragging the unhardened liquid and the nature of the unhardened liquid of entering the clearance. When recesses are provided in the lower surface of the recoater, the liquid adsorbed to the surfaces thereof is also introduced onto the unhardened layer.

Inventors:

NARUKAWA HIDETAKA (JP)
SAITO NAOICHIRO (JP)
HAYANO SEIJI (JP)
TANI KAZUNORI (JP)
NARUO HATSUMI (JP)
SARADA ICHITARO (JP)

Application Number:

PCT/JP1993/000439

Publication Date:

December 09, 1993

Filing Date:

April 05, 1993

Export Citation:

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Assignee:

CMET INC (JP)
YAC CORP (JP)
NARUKAWA HIDETAKA (JP)
SAITO NAOICHIRO (JP)
HAYANO SEIJI (JP)
TANI KAZUNORI (JP)
NARUO HATSUMI (JP)
SARADA ICHITARO (JP)

International Classes:

B29C31/04; B29C35/08; B29C41/12; B29C67/00; (IPC1-7): B29C67/00; B29C35/08

Foreign References:

JPH04169223A	1992-06-17
JPH04118222A	1992-04-20
JPS61114818A	1986-06-02

Other References: