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Patent Searching and Data


Title:
PHOTONIC COMPONENT AND METHOD FOR PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/210383
Kind Code:
A8
Abstract:
The invention relates to a photonic component (10) having a photonically integrated chip (1) and a fibre mounting (5), wherein the fibre mounting (5) has: at least one groove (52), into which an optical fibre (30) is placed, and at least one mirror surface (52), which reflects radiation (S) from the fibre (30) in the direction of the photonically integrated chip (1) and/or reflects radiation (S) from the photonically integrated chip (1) in the direction of the fibre (30). According to the invention a chip stack (20) comprising at least two chips is arranged between the photonically integrated chip (1) and the fibre mounting (5), the chip stack (20) has at least two through holes (21) and in each case a guide pin (40), which positions the chip stack (20) and the fibre mounting (5) relative to one another, passes through the at least two through holes (21) of the chip stack (20).

Inventors:
MEISTER, Stefan (Müggelseedamm 260, Berlin, 12587, DE)
GREHN, Moritz (Simplonstraße 25, Berlin, 10245, DE)
OTTE, Sven (Ernst-Schneller-Straße 3, Hohen Neuendorf, 16540, DE)
HÖLL, Sebastian (Gottschalkstraße 29, Berlin, 13359, DE)
Application Number:
DE2018/200042
Publication Date:
February 07, 2019
Filing Date:
May 02, 2018
Export Citation:
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Assignee:
SICOYA GMBH (Carl-Scheele-Straße 16, Berlin, 12489, DE)
International Classes:
G02B6/42
Attorney, Agent or Firm:
FISCHER, Uwe (Moritzstraße 22, Berlin, 13597, DE)
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