PHOTONIC SINTERING OF POLYMER THICK FILM COPPER CONDUCTOR COMPOSITIONS

Title:

PHOTONIC SINTERING OF POLYMER THICK FILM COPPER CONDUCTOR COMPOSITIONS

Document Type and Number:

WIPO Patent Application WO/2015/050589

Kind Code:

A3

Abstract:

This invention provides a method for using a polymer thick film copper conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film copper conductor composition to photonic sintering. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to photonic sintering. The invention further provides devices containing electrical conductors made by these methods. The invention also provides a polymer thick film copper conductor composition.

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Inventors:

SUMMERS JOHN D (US)

Application Number:

PCT/US2014/041196

Publication Date:

June 04, 2015

Filing Date:

June 06, 2014

Export Citation:

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Assignee:

DU PONT (US)

International Classes:

H01B1/22; C09D5/24; H05K3/12

Domestic Patent References:

WO2009111393A2

2009-09-11

Foreign References:

EP0239901A2	1987-10-07
US20080020304A1	2008-01-24
US20130142963A1	2013-06-06

Attorney, Agent or Firm:

HAAS, Charles, W. (Legal Patent Records CenterChestnut Run Plaza 721/2340,974 Centre Roa, PO Box 2915 Wilmington Delaware, US)

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