Title:
PHOTORADIATION-RELEASABLE ADHESIVE COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/234155
Kind Code:
A1
Abstract:
The present invention provides: a laminate having an adhesive layer that has both a bonding function and a release function in a single layer and can be released using photoradiation, the laminate being capable of firmly bonding together a support substrate and a semiconductor substrate during polishing of the semiconductor substrate and making it possible to easily release the support substrate and the semiconductor substrate using photoradiation after the polishing; an adhesive composition for forming an adhesive layer that can be released in the manner described above; and a method for producing a processed semiconductor substrate using such a laminate. A photoradiation-releasable adhesive composition for forming an adhesive layer in a laminate having a semiconductor substrate, a support substrate, and the adhesive layer, which is provided between the semiconductor substrate and the support substrate, the laminate also being used in releasing the semiconductor substrate and the support substrate after the adhesive layer has absorbed light emitted from the support-substrate side, wherein the adhesive composition includes an adhesive component (S) and a release agent component (R), the adhesive component (S) contains a polysiloxane-based resin, and the release agent component (R) contains a (meth)acrylic polymer including a first unit that is based on silicone and a second unit that has a structure for absorbing light.
Inventors:
OKUNO TAKAHISA (JP)
YANAI MASAKI (JP)
SHINJO TETSUYA (JP)
YANAI MASAKI (JP)
SHINJO TETSUYA (JP)
Application Number:
PCT/JP2023/019427
Publication Date:
December 07, 2023
Filing Date:
May 25, 2023
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
H01L21/304; C09J183/04; C09J183/07
Domestic Patent References:
| WO2021193514A1 | 2021-09-30 | |||
| WO2021193516A1 | 2021-09-30 | |||
| WO2021166905A1 | 2021-08-26 | |||
| WO2022019211A1 | 2022-01-27 | |||
| WO2022045026A1 | 2022-03-03 | |||
| WO2020105586A1 | 2020-05-28 |
Foreign References:
| JP2020161823A | 2020-10-01 | |||
| JP2020012020A | 2020-01-23 |
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
Download PDF: