PHOTORESIST COMPOSITIONS AND PROCESSESS OF USE

Title:

PHOTORESIST COMPOSITIONS AND PROCESSESS OF USE

Document Type and Number:

WIPO Patent Application WO2005067567

Kind Code:

A3

Abstract:

Photoresist compositions that demonstrate superior photolithographic performance and hardened resist films that show superior resistance to solvents, have excellent resistance to under plating during the electrodeposition of metals, and show excellent resist stripping characteristics. These photoresist compositions according to the invention are well-suited as for applications in the manufacture of MEMS and micromachine devices. These photoresist compositions according to the invention comprise one or more epoxide-substituted, polycarboxylic acid Resin Component (A), one or more photoacid generator compounds (B), and one or more solvent (C).

Inventors:

WEBER WILLIAM (US)
MORI SATOSHI (JP)
HONDA NAO (JP)

Application Number:

PCT/US2005/000156

Publication Date:

July 13, 2006

Filing Date:

January 05, 2005

Export Citation:

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Assignee:

MICROCHEM CORP (US)
NIPPON KAYAKU KK (JP)

International Classes:

G03F7/038; G03C1/76; G03F7/004; G03F7/30; G03F7/40; G03F7/11

Foreign References:

JPH1097070A	1998-04-14
US4354895A	1982-10-19
US4229265A	1980-10-21

Other References: