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Title:
PHOTORESIST FILM ROLL AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2006/137243
Kind Code:
A1
Abstract:
Provided are a photoresist film roll which prevents cold flow when a photosensitive resin layer has flowability and is soft, and suppresses generation of chip pieces while being cut when the photosensitive resin layer is hard, and a method for manufacturing such photoresist film roll. In the photoresist film roll, the photosensitive resin layer (2) is applied so that the width thereof is less than the width of a supporting film (1a), and the photosensitive resin layer (2) is bonded so that the width thereof is less than the width of a protecting film (1b).

Inventors:
UEMATSU TERUHIRO (JP)
TAKAHASHI TORU (JP)
SAITO KOJI (JP)
Application Number:
PCT/JP2006/310591
Publication Date:
December 28, 2006
Filing Date:
May 26, 2006
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
UEMATSU TERUHIRO (JP)
TAKAHASHI TORU (JP)
SAITO KOJI (JP)
International Classes:
G03F7/004
Foreign References:
JPS5246901U1977-04-02
JPH01276694A1989-11-07
JPS5350469U1978-04-28
JPS61279847A1986-12-10
JPH05267831A1993-10-15
JPH0254255A1990-02-23
JPH10115912A1998-05-06
JPH1124251A1999-01-29
JP2002099079A2002-04-05
JP2004034439A2004-02-05
Attorney, Agent or Firm:
Osuga, Yoshiyuki (Nibancho Bldg. 8-20, Nibanch, Chiyoda-ku Tokyo 84, JP)
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