PHOTORESIST REMOVER COMPOSITION

Title:

PHOTORESIST REMOVER COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2023/140344

Kind Code:

A1

Abstract:

The present invention addresses the problem of providing a photoresist remover composition which has the high ability to remove cured resists and is effective in inhibiting the corrosion of substrate-constituting metals in contact therewith, such as Cu and Al, and in inhibiting the Cu and other metals from being excessively oxidized during the removal process. This photoresist remover composition comprises (A) a quaternary ammonium hydroxide, (B) diethylene glycol monoethyl ether, (C) glycerin, and (D) water, wherein the content of (A) is 0.5-5 mass% with respect to the whole mass of the composition, the content of (B) is 50-95 mass% with respect to the whole mass of the composition, the content of (C) is 0.5-20 mass% with respect to the whole mass of the composition, and the content of (D) is less than 20 mass% with respect to the whole mass of the composition.

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Inventors:

SASAKI RYO (JP)
ITO TSUBASA (JP)
SHIMIZU TOSHIKAZU (JP)

Application Number:

PCT/JP2023/001639

Publication Date:

July 27, 2023

Filing Date:

January 20, 2023

Export Citation:

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Assignee:

KANTO KAGAKU (JP)

International Classes:

C11D1/62; C11D3/20; G03F7/42; H05K3/06

Foreign References:

JP2012017465A	2012-01-26
JP2011118101A	2011-06-16
JP2003526111A	2003-09-02
JP2008058625A	2008-03-13
JP6970813B2	2021-11-24

Attorney, Agent or Firm:

KUZUWA, Kiyoshi (JP)

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