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Patent Searching and Data


Title:
PHOTOSENSITIVE ADHESIVE COMPOSITION HAVING ADHESIVENESS EVEN AFTER PHOTOCURING REACTION AND AFTER PATTERN FORMATION
Document Type and Number:
WIPO Patent Application WO/2011/071107
Kind Code:
A1
Abstract:
Provided is a photosensitive adhesive composition having adhesiveness even after photocuring reaction and after pattern formation, the composition attaining high adhesive strength, having heat resistance, imparting high reliability to semiconductors, and showing excellent alkali developability. The photosensitive adhesive composition having adhesiveness even after photocuring reaction and after pattern formation includes a resin composition which contains, as a main resin component, an alkali-soluble resin obtained from a product of the reaction of (meth)acrylic acid with an epoxy compound having two glycidyl ether groups and derived from a bisphenol compound, by reacting the reaction product with a) a dicarboxylic acid (or tricarboxylic acid) or the anhydride thereof and b) a tetracarboxylic acid or the dianhydride thereof, the a/b molar ratio being in the range of 0.1-10.

Inventors:
TAKANO MASAOMI (JP)
NAMEKAWA SHUHEI (JP)
AOYAMA TAKESHI (JP)
Application Number:
JP2010/072117
Publication Date:
June 16, 2011
Filing Date:
December 09, 2010
Export Citation:
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Assignee:
NIPPON STEEL CHEMICAL CO (JP)
TAKANO MASAOMI (JP)
NAMEKAWA SHUHEI (JP)
AOYAMA TAKESHI (JP)
International Classes:
C09J163/10; C08F299/02; C08G63/676; C09J4/00; C09J11/06; C09J163/00; G03F7/027; H01L21/52
Domestic Patent References:
WO2006129669A12006-12-07
Foreign References:
JPH1022641A1998-01-23
JPH05339356A1993-12-21
JP2003176343A2003-06-24
JP2006003860A2006-01-05
JP2009185270A2009-08-20
JPH10183088A1998-07-07
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
Kazuya Sasaki (JP)
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