Title:
PHOTOSENSITIVE ADHESIVE, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, AND SEMICONDUCTOR DEVICE, WHICH ARE MADE USING SAME
Document Type and Number:
WIPO Patent Application WO/2011/001942
Kind Code:
A1
Abstract:
Provided is an alkali-developable photosensitive adhesive which excels sufficiently in applicability, pattern formation properties, thermocompression bondability, and high -temperature adhesiveness and which is thermocompression -bondable to an adherend even after the photosensitive adhesive has been subjected to patterning accompanied with light exposure and development. Also provided are a film adhesive, an adhesive sheet, an adhesive pattern, a semiconductor wafer with an adhesive layer, and a semiconductor device, which are made using the alkali-developable photosensitive adhesive. The photosensitive adhesive comprises (A) an imido-containing resin which has a fluoroalkyl group, (B) a radiation-polymerizable compound, (C) a photopolymerization initiator, and (D) a thermosetting component.
Inventors:
MITSUKURA KAZUYUKI (JP)
KAWAMORI TAKASHI (JP)
MASUKO TAKASHI (JP)
KATOGI SHIGEKI (JP)
KAWAMORI TAKASHI (JP)
MASUKO TAKASHI (JP)
KATOGI SHIGEKI (JP)
Application Number:
PCT/JP2010/060988
Publication Date:
January 06, 2011
Filing Date:
June 28, 2010
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
MITSUKURA KAZUYUKI (JP)
KAWAMORI TAKASHI (JP)
MASUKO TAKASHI (JP)
KATOGI SHIGEKI (JP)
MITSUKURA KAZUYUKI (JP)
KAWAMORI TAKASHI (JP)
MASUKO TAKASHI (JP)
KATOGI SHIGEKI (JP)
International Classes:
C09J201/00; C09J4/00; C09J7/22; C09J7/35; C09J11/06; C09J163/00; C09J179/08; G03F7/004; G03F7/037; H01L21/52
Domestic Patent References:
| WO2009072492A1 | 2009-06-11 | |||
| WO2008149625A1 | 2008-12-11 | |||
| WO2008123110A1 | 2008-10-16 | |||
| WO2007004569A1 | 2007-01-11 | |||
| WO2007052540A1 | 2007-05-10 |
Foreign References:
| JP2008274269A | 2008-11-13 | |||
| JP2008088403A | 2008-04-17 | |||
| JP2002003795A | 2002-01-09 | |||
| JPH10330616A | 1998-12-15 | |||
| JP2008094967A | 2008-04-24 | |||
| JPH04284455A | 1992-10-09 | |||
| JPH05232701A | 1993-09-10 | |||
| JP2009009107A | 2009-01-15 | |||
| JPS63268739A | 1988-11-07 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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