Title:
PHOTOSENSITIVE COMPOSITION, HARDENED COATING FILMS THEREFROM, AND PRINTED WIRING BOARDS USING SAME
Document Type and Number:
WIPO Patent Application WO/2012/137838
Kind Code:
A1
Abstract:
Provided is a photosensitive composition which is a composition containing a carboxyl group-containing resin, a photopolymerization initiator, a photosensitive acrylate compound and a filler, wherein the refractive index of the filler is 1.5 - 1.6, and the dry coated film thereof shows absorbance of at least either 0.01 - 0.2 at a wavelength of 365 nm or 0.01 - 0.2 at a wavelength of 405 nm for a thickness of 25 µm. Filler content is preferably 20 - 60 wt% of the entire composition. This photosensitive composition can be usefully employed as a plating resist or solder resist for a printed wiring board, and is particularly useful for forming very finely patterned resist films with a high aspect ratio.
Inventors:
IWAYAMA GENTO (JP)
ARIMA MASAO (JP)
ARIMA MASAO (JP)
Application Number:
PCT/JP2012/059240
Publication Date:
October 11, 2012
Filing Date:
April 04, 2012
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
IWAYAMA GENTO (JP)
ARIMA MASAO (JP)
IWAYAMA GENTO (JP)
ARIMA MASAO (JP)
International Classes:
G03F7/004; G03F7/027; G03F7/031; H05K3/18
Domestic Patent References:
| WO2006004158A1 | 2006-01-12 | |||
| WO2008120491A1 | 2008-10-09 |
Foreign References:
| JP2003131362A | 2003-05-09 | |||
| JPH1098266A | 1998-04-14 | |||
| JP2007522531A | 2007-08-09 | |||
| JP2007248925A | 2007-09-27 |
Attorney, Agent or Firm:
Shigeki Yoshida (JP)
YOSHIDA, SHIGEKI (JP)
YOSHIDA, SHIGEKI (JP)
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Claims: