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Title:
PHOTOSENSITIVE COMPOSITION, POLYMER, RESIN FILM, METHOD FOR PRODUCING RESIN FILM, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2014/109143
Kind Code:
A1
Abstract:
[Problem] To provide a photoresist material having excellent resolution. [Solution] A photosensitive composition which contains (A) a polymer that has a structural unit represented by formula (A1) and (B) a photosensitive acid generator. (In formula (A1), Ar1 represents a divalent group having an aromatic ring, wherein two bonding hands are present on the aromatic ring structure, provided that Ar1 has at least one group selected from among phenolic hydroxyl groups and a carboxyl group; and R1 represents an alkanediyl group, a divalent group having a saturated aliphatic ring, or a divalent group represented by formula (A2) -R2-Ar2-R3- (wherein Ar2 represents an arylene group; and each of R2 and R3 independently represents an alkanediyl group).)

Inventors:
UCHIDA TAROU (JP)
NISHIMURA ISAO (JP)
MATSUMURA TOORU (JP)
INOMATA KATSUMI (JP)
MARUYAMA YOUICHIROU (JP)
Application Number:
PCT/JP2013/082202
Publication Date:
July 17, 2014
Filing Date:
November 29, 2013
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
G03F7/023; C08G65/40; C08K5/28; C08L71/10; G03F7/038; H01L21/027
Foreign References:
JP2009242756A2009-10-22
JP2011074314A2011-04-14
JP2002251014A2002-09-06
JP2010113142A2010-05-20
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Patent business corporation SSINPAT (JP)
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