Title:
PHOTOSENSITIVE COMPOSITION, TRANSFER FILM, LAMINATE PRODUCTION METHOD, LAMINATE, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/048317
Kind Code:
A1
Abstract:
The present invention addresses a first problem of providing a photosensitive composition from which it is possible to form a pattern having a low relative permittivity and excellent resolution. The present invention addresses a second problem of providing a transfer film, a laminate production method, a laminate, and a semiconductor package, in which the photosensitive composition is involved. A photosensitive composition according to the present invention contains a siloxane polymer having a carboxy group, and a compound β having a structure that reduces the amount of the carboxy group in the siloxane polymer through light exposure.
Inventors:
KODAMA KUNIHIKO (JP)
YAMAGUCHI KEIGO (JP)
YAMAGUCHI KEIGO (JP)
Application Number:
PCT/JP2023/029782
Publication Date:
March 07, 2024
Filing Date:
August 18, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C08G77/26; C08G77/28; G03F7/075; H05K1/03
Domestic Patent References:
| WO2018216570A1 | 2018-11-29 |
Foreign References:
| JP2018146958A | 2018-09-20 | |||
| JPH10324748A | 1998-12-08 | |||
| JP2018123234A | 2018-08-09 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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