PHOTOSENSITIVE COMPOSITION, TRANSFER FILM, METHOD FOR MANUFACTURING LAMINATE, LAMINATE, AND SEMICONDUCTOR PACKAGE

Title:

PHOTOSENSITIVE COMPOSITION, TRANSFER FILM, METHOD FOR MANUFACTURING LAMINATE, LAMINATE, AND SEMICONDUCTOR PACKAGE

Document Type and Number:

WIPO Patent Application WO/2024/024820

Kind Code:

A1

Abstract:

The present invention addresses the problem of providing a photosensitive composition having excellent photolithographic properties and a small linear expansion coefficient in an obtained cured film. The photosensitive composition according to the present invention contains a polybenzoxazole precursor resin having a polymerizable group, and a photopolymerization initiator.

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Inventors:

KODAMA KUNIHIKO (JP)
YAMADA SATORU (JP)
YAMAGUCHI KEIGO (JP)

Application Number:

PCT/JP2023/027329

Publication Date:

February 01, 2024

Filing Date:

July 26, 2023

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

G03F7/027; B32B7/06; B32B27/16; B32B27/20; B32B27/34; G03F7/004; G03F7/09; G03F7/20; G03F7/32; G03F7/40

Domestic Patent References:

WO2022070730A1	2022-04-07
WO2017159876A1	2017-09-21

Foreign References:

JP2013068797A	2013-04-18
JP2002012665A	2002-01-15
JP2001075280A	2001-03-23

Attorney, Agent or Firm:

ITOH Hideaki et al. (JP)

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