Title:
PHOTOSENSITIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/047850
Kind Code:
A1
Abstract:
Provided are: a photosensitive composition which contains a radical-polymerizable compound (A) and a radical polymerization initiator (C), and which, even if heated, does not undergo excessive reduction in terms of weight of components other than a solvent in the photosensitive composition or weight of a cured product, and which exhibits a good curing properties; and a cured product of the photosensitive composition. In this photosensitive composition which contains the radical-polymerizable compound (A) and the radical polymerization initiator (C), a combination of a compound having a specific structure having a radical-polymerizable group-containing group and a radical-polymerizable compound that is different from the compound having the specific structure is used as the radical-polymerizable compound (A).
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Inventors:
URAKAWA KAZUKI (JP)
SHIOTA DAI (JP)
SHIOTA DAI (JP)
Application Number:
PCT/JP2022/031217
Publication Date:
March 30, 2023
Filing Date:
August 18, 2022
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
C08F2/48; C08F2/44; C08F20/10
Foreign References:
| JP2012185477A | 2012-09-27 | |||
| JPH05295692A | 1993-11-09 | |||
| JPH05311102A | 1993-11-22 | |||
| JPH05295040A | 1993-11-09 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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