Title:
PHOTOSENSITIVE CONDUCTIVE FILM, LAYERED BODY AND METHOD FOR MANUFACTURING SAME, AND TOUCH PANEL SENSOR
Document Type and Number:
WIPO Patent Application WO/2020/044467
Kind Code:
A1
Abstract:
This method for manufacturing a layered body 30 comprises a step for providing, on a substrate 20, a cured resin layer 7 and a conductive pattern 8 provided on one principal surface of the cured resin layer 7 such that the conductive pattern 8 is positioned on the side of the cured resin layer 7 opposite the substrate 20. Said step includes: a step for providing a photosensitive resin layer 3 and a conductive network 2 on the substrate 20; a first exposure step for irradiating the photosensitive resin layer 3 with active light rays in a pattern; a second exposure step for irradiating at least a portion of an unexposed section of the photosensitive resin layer after the first exposure step with active light rays in the presence of oxygen; and a step for developing the photosensitive resin layer after the second exposure step. The photosensitive resin layer 3 contains (a) a binder polymer, (b) a photopolymerizable compound having an ethylenic unsaturated bond, and (c) a photopolymerization initiator. The photopolymerization initiator contains a phosphine oxide compound and an alkylphenone compound.
Inventors:
YOSHIHARA KENSUKE (JP)
TERAWAKI TOMONORI (JP)
TERAWAKI TOMONORI (JP)
Application Number:
PCT/JP2018/031985
Publication Date:
March 05, 2020
Filing Date:
August 29, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01B13/00; G06F3/041; H01B5/14
Domestic Patent References:
| WO2016158419A1 | 2016-10-06 | |||
| WO2017169612A1 | 2017-10-05 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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