Title:
PHOTOSENSITIVE CONDUCTIVE FILM, METHOD FOR MANUFACTURING CONDUCTIVE PATTERN, CONDUCTIVE PATTERN SUBSTRATE, AND TOUCH PANEL SENSOR
Document Type and Number:
WIPO Patent Application WO/2018/008599
Kind Code:
A1
Abstract:
Disclosed is a photosensitive conductive film which is provided with a photosensitive resin layer comprising a conductive network formed by using conductive fibers on one primary surface side thereof, wherein the thickness of the photosensitive resin layer is 27 μm or greater.
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Inventors:
TERAWAKI TOMONORI (JP)
NAKAMURA KANAMI (JP)
AJIOKA YOSHIKI (JP)
NAKAMURA KANAMI (JP)
AJIOKA YOSHIKI (JP)
Application Number:
PCT/JP2017/024373
Publication Date:
January 11, 2018
Filing Date:
July 03, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
G03F7/004; G06F3/041; G06F3/044; H05K3/10
Domestic Patent References:
WO2011155412A1 | 2011-12-15 | |||
WO2015056445A1 | 2015-04-23 |
Foreign References:
JP2012162601A | 2012-08-30 | |||
JP2009252493A | 2009-10-29 | |||
JP2011070821A | 2011-04-07 | |||
JP2014178465A | 2014-09-25 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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