PHOTOSENSITIVE CONDUCTIVE FILM, METHOD FOR MANUFACTURING CONDUCTIVE PATTERN, CONDUCTIVE PATTERN SUBSTRATE, AND TOUCH PANEL SENSOR

Title:

PHOTOSENSITIVE CONDUCTIVE FILM, METHOD FOR MANUFACTURING CONDUCTIVE PATTERN, CONDUCTIVE PATTERN SUBSTRATE, AND TOUCH PANEL SENSOR

Document Type and Number:

WIPO Patent Application WO/2018/008599

Kind Code:

A1

Abstract:

Disclosed is a photosensitive conductive film which is provided with a photosensitive resin layer comprising a conductive network formed by using conductive fibers on one primary surface side thereof, wherein the thickness of the photosensitive resin layer is 27 μm or greater.

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Inventors:

TERAWAKI TOMONORI (JP)
NAKAMURA KANAMI (JP)
AJIOKA YOSHIKI (JP)

Application Number:

PCT/JP2017/024373

Publication Date:

January 11, 2018

Filing Date:

July 03, 2017

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)

International Classes:

G03F7/004; G06F3/041; G06F3/044; H05K3/10

Domestic Patent References:

WO2011155412A1	2011-12-15
WO2015056445A1	2015-04-23

Foreign References:

JP2012162601A	2012-08-30
JP2009252493A	2009-10-29
JP2011070821A	2011-04-07
JP2014178465A	2014-09-25

Attorney, Agent or Firm:

HASEGAWA Yoshiki et al. (JP)

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