Title:
PHOTOSENSITIVE CONDUCTIVE FILM, CONDUCTIVE FILM SET AND METHOD OF MANUFACTURING SURFACE PROTECTION FILM AND BASE FILM HAVING CONDUCTIVE PATTERN USING SAME, AND METHOD OF MANUFACTURING BASE FILM HAVING CONDUCTIVE PATTERN
Document Type and Number:
WIPO Patent Application WO/2016/006024
Kind Code:
A1
Abstract:
This photosensitive conductive film includes, in order: a support film; a conductive layer containing conductive fibers; a photosensitive resin layer; a base film; and a surface protection film. This method of manufacturing a surface protection film/base film having a conductive pattern includes: a first exposure step for applying activation light in a patterned manner to the photosensitive conductive film from the support film side; a second exposure step for applying, after the separation of the support film and in the presence of oxygen, activation light to at least part or all of the portions of the photosensitive conductive film which were not exposed in the first exposure step; and a development step for forming a conductive pattern by developing the conductive layer and the photosensitive resin layer after the second exposure step.
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Inventors:
NAKAMURA KANAMI (JP)
YAMAZAKI HIROSHI (JP)
TANAKA HIROYUKI (JP)
YAMAZAKI HIROSHI (JP)
TANAKA HIROYUKI (JP)
Application Number:
PCT/JP2014/068049
Publication Date:
January 14, 2016
Filing Date:
July 07, 2014
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01B5/14; B32B15/08; B32B27/12; H01B13/00
Domestic Patent References:
WO2013051516A1 | 2013-04-11 |
Foreign References:
JP2009505358A | 2009-02-05 | |||
JP2013073828A | 2013-04-22 | |||
JP2013224397A | 2013-10-31 |
Attorney, Agent or Firm:
MINAKAWA Kazuyasu (JP)
Kazuyasu Minagawa (JP)
Kazuyasu Minagawa (JP)
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