Title:
PHOTOSENSITIVE CONDUCTIVE PASTE, FILM FOR USE IN CONDUCTIVE PATTERN FORMING, AND LAYERED MEMBER
Document Type and Number:
WIPO Patent Application WO/2020/110453
Kind Code:
A1
Abstract:
Provided are a photosensitive conductive paste, a film for use in conductive pattern forming, and a layered member, allowing for microfabrication and capable of suppressing a drop in conductivity in a metal fiber-containing transparent electrode under a high temperature and high humidity environment. The photosensitive conductive paste comprises an organometallic compound (A), a carboxyl group-containing resin (B), a photopolymerization initiator (C), a compound (D) having an unsaturated double bond, and conductive particles (E). In addition, the layered member has a transparent electrode layer including a binder resin (X) and metal fibers over a base material, at least some of the metal fibers being exposed, and a conductive layer, and the conductive layer comprises a cured product of a composition containing the organometallic compound (A), a binder resin (Y), and the conductive particles (E).
Inventors:
ITSUKI NAOHIDE (JP)
MIZUGUCHI TSUKURU (JP)
MIZUGUCHI TSUKURU (JP)
Application Number:
PCT/JP2019/038521
Publication Date:
June 04, 2020
Filing Date:
September 30, 2019
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/004; G03F7/027; G03F7/09; H01B1/20; H01B5/14; H05K1/09
Domestic Patent References:
| WO2018061384A1 | 2018-04-05 | |||
| WO2018038074A1 | 2018-03-01 | |||
| WO2018016480A1 | 2018-01-25 | |||
| WO2016170943A1 | 2016-10-27 | |||
| WO2018122958A1 | 2018-07-05 |
Foreign References:
| JP2014142587A | 2014-08-07 | |||
| JP2010020088A | 2010-01-28 | |||
| JP2015069908A | 2015-04-13 |
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