Title:
PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR PRODUCING BASE MATERIAL WITH CONDUCTIVE PATTERN, METHOD FOR PRODUCING ELECTRONIC COMPONENT, CURED FILM, FIRED BODY AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/032536
Kind Code:
A1
Abstract:
The present invention provides a photosensitive conductive paste which contains conductive particles (A), a photosensitive organic component (B) and two or more solvents (C), wherein: the difference between the boiling points of a solvent (C-1) that has the lowest boiling point and a solvent (C-2) that has the highest boiling point among the solvents (C) is 35°C to 120°C; the boiling point of the solvent (C-2) is 251°C to 300°C; and the amount of the solvent (C-2) relative to 100% by mass of all solvents is 25% by mass to 80% by mass. This photosensitive conductive paste is suppressed in viscosity increase during a coating step; and even in cases where the photosensitive conductive paste is dried at low temperatures, the tack properties of a dried film are suppressed and change with time of the residual solvent amount in the dried film is also suppressed.
Inventors:
TAKASE KOHEI (JP)
KOYAMA MARIE (JP)
HASHIMOTO TAIKI (JP)
KOYAMA MARIE (JP)
HASHIMOTO TAIKI (JP)
Application Number:
PCT/JP2022/029091
Publication Date:
March 09, 2023
Filing Date:
July 28, 2022
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
B22F7/04; B22F1/00; B22F1/103; G03F7/004
Domestic Patent References:
| WO2015151892A1 | 2015-10-08 |
Foreign References:
| JP2020105442A | 2020-07-09 | |||
| JP2016071171A | 2016-05-09 | |||
| JP2011509437A | 2011-03-24 | |||
| JP2017186550A | 2017-10-12 |
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