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Title:
PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2006/043314
Kind Code:
A1
Abstract:
A photosensitive element, which has excellent sensitivity and resolution to the exposure to beams, especially those having a wavelength of 400-450nm, and has an almost square resist cross-section after development, a method for forming a resist pattern, and a method for manufacturing a printed circuit board. The photosensitive element is provided with a support and a photosensitive resin composition layer thereon being composed of (A) a binder polymer, (B) a photopolymeric compound having an ethylene unsaturated bond and (C) a photosensitive resin composition containing a photopolymeric initiator. The photosensitive resin composition contains a coumarin compound as an ingredient of the composition (C). The photosensitive element satisfies an inequality of 10.0≤R≤26.3, where, P is parts per weight of the coumarin compound to the total quantity of 100 parts per weight of the ingredients (A) and (B), Q[μm] is a film thickness of the photosensitive resin composition layer and R is a product of P and Q.

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Inventors:
MIYASAKA MASAHIRO (JP)
KUMAKI TAKASHI (JP)
ICHIHASHI YASUHISA (JP)
KAJI MAKOTO (JP)
ITO TOSHIKI (JP)
Application Number:
PCT/JP2004/015433
Publication Date:
April 27, 2006
Filing Date:
October 19, 2004
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
MIYASAKA MASAHIRO (JP)
KUMAKI TAKASHI (JP)
ICHIHASHI YASUHISA (JP)
KAJI MAKOTO (JP)
ITO TOSHIKI (JP)
International Classes:
G03F7/004; G03F7/031; (IPC1-7): G03F7/031; G03F7/004
Foreign References:
JP2001174992A2001-06-29
JP2002351086A2002-12-04
JP2001133968A2001-05-18
JP2000310855A2000-11-07
JP2003167341A2003-06-13
Attorney, Agent or Firm:
Hasegawa, Yoshiki (Ginza First Bldg. 10-6, Ginza 1-chome, Chuo-k, Tokyo 61, JP)
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