PHOTOSENSITIVE HEAT-CURABLE RESIN COMPOSITION AND FLEXIBLE PRINTED WIRING BOARD

Title:

PHOTOSENSITIVE HEAT-CURABLE RESIN COMPOSITION AND FLEXIBLE PRINTED WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2015/064280

Kind Code:

A1

Abstract:

Provided are the following: a photosensitive heat-curable resin composition having excellent flame-retardance, insulation reliability, and bending resistance properties; a dry film; and a flexible printed wiring board provided with a cured product of the photosensitive heat-curable resin composition. The present invention is a photosensitive heat-curable resin composition characterized by comprising (A) a polyimide resin having an imide ring and a carboxyl group, (B) a photobase generator, (C) a thermal curing component, and (D) a flame retardant. Preferably, the invention comprises substantially no (meth)acrylate monomer.

More Like This:

JP2007056196	POLYIMIDE PRECURSOR COMPOSITION, METHOD FOR PRODUCING POLYIMIDE FILM AND SEMICONDUCTOR DEVICE
JPS60203938	PHOTOSENSITIVE PAPER FOR USE IN SUNLIGHT PHOTOGRAPHY
JP3587413	Chemically amplified resist composition and acid generator used therein

Inventors:

MIYABE HIDEKAZU (JP)
HAYASHI MAKOTO (JP)
YOKOYAMA YUTAKA (JP)
KOIKE NAOYUKI (JP)

Application Number:

PCT/JP2014/076170

Publication Date:

May 07, 2015

Filing Date:

September 30, 2014

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TAIYO INK MFG CO LTD (JP)

International Classes:

G03F7/038; G03F7/004

Domestic Patent References:

WO2013171888A1

2013-11-21

Foreign References:

JP2011095355A	2011-05-12
JP2012237864A	2012-12-06
JP2010032743A	2010-02-12

Attorney, Agent or Firm:

HONDA ICHIRO (JP)
Ichiro Honda (JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: IMAGE CAPTURE DEVICE AND CONTROL METHOD THEREFOR

Next Patent: HIGH-PRESSURE FUEL PUMP