Title:
PHOTOSENSITIVE LAYER, LAMINATE, PHOTOSENSITIVE RESIN COMPOSITION, AND KIT
Document Type and Number:
WIPO Patent Application WO/2019/163951
Kind Code:
A1
Abstract:
Provided are a photosensitive layer, a laminate, a photosensitive resin composition, and a kit. The photosensitive layer is included in a laminate having a water-soluble resin layer and the photosensitive layer, and is formed from a photosensitive resin composition containing: a compound capable of generating an acid upon irradiation with actinic rays or radiation; and a resin of which the dissolution rate in butyl acetate varies according to the action of an acid. The resin of which the dissolution rate in butyl acetate varies according to the action of an acid has a weight average molecular weight of 10,000-50,000, and is a hydrophobic resin which is soluble in butyl acetate at 23°C and in which 50-100 mol% of units soluble in an aqueous alkali solution among the total constituent units are protected by a hydrophobic protection group. The dissolution rate of the unirradiated photosensitive layer when immersed in butyl acetate at 23°C is 20-200 nm/s. The static contact angle of the photosensitive resin composition on the water-soluble resin layer is 60° or less.
Inventors:
MASUDA SEIYA (JP)
Application Number:
PCT/JP2019/006811
Publication Date:
August 29, 2019
Filing Date:
February 22, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/038; C08F20/28; C08F212/14; G03F7/039; G03F7/11
Domestic Patent References:
| WO2016175220A1 | 2016-11-03 | |||
| WO2012008546A1 | 2012-01-19 |
Foreign References:
| JP2015194674A | 2015-11-05 | |||
| JP2015087609A | 2015-05-07 | |||
| JP2014098889A | 2014-05-29 | |||
| JP2006343704A | 2006-12-21 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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