Title:
PHOTOSENSITIVE MULTILAYER RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/190798
Kind Code:
A1
Abstract:
The present invention pertains to a photosensitive multilayer resin film having a first resin composition layer and a second resin composition layer, wherein: each of the first resin composition layer and the second resin composition layer comprises (A) a compound having an ethylenically unsaturated group, (B) a thermosetting resin, (C) a photopolymerization initiator, and (D) an inorganic filler; the second resin composition layer further comprises (E) a fluorine-containing resin; and the concentration of fluorine atoms in the first resin composition layer is lower than the concentration of fluorine atoms in the second resin composition layer.
Inventors:
KONNO YUKO (JP)
AYUGASE TOMOHIRO (JP)
YUKIOKA RYO (JP)
AYUGASE TOMOHIRO (JP)
YUKIOKA RYO (JP)
Application Number:
PCT/JP2023/013040
Publication Date:
October 05, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
G03F7/095; G03F7/004; G03F7/032; G03F7/033; H05K1/03; H05K3/46
Domestic Patent References:
| WO2021253727A1 | 2021-12-23 |
Foreign References:
| JP2006285179A | 2006-10-19 | |||
| JP2005055655A | 2005-03-03 | |||
| JP2013173841A | 2013-09-05 | |||
| JP2017088438A | 2017-05-25 | |||
| JP2019179200A | 2019-10-17 | |||
| JP2022025366A | 2022-02-10 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
Download PDF:
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