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Patent Searching and Data


Title:
PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION AND POLYIMIDE FILM THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/150913
Kind Code:
A1
Abstract:
Provided is a photosensitive polyimide resin composition comprising: (a) a photosensitive polyimide represented by formula (1); (b) titanium dioxide having a particle size of 0.2μm to 10μm; (c) a photoradical initiator; (d) a radically polymerizable compound; and (e) a solvent for dissolving the photosensitive polyimide, wherein X is derived from a tetracarboxylic dianhydride, Y is derived from a diamine, and m is a positive integer from 1 to 5000.

Inventors:
HUANG TANG CHIEH (CN)
CHUANG CHAU CHIN (CN)
SHIH YU CHIAO (CN)
HSIEH KUN HAN (CN)
Application Number:
PCT/CN2019/072780
Publication Date:
July 30, 2020
Filing Date:
January 23, 2019
Export Citation:
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Assignee:
MICROCOSM TECH CO LTD (CN)
International Classes:
G03F7/004; C08G73/10; C08L79/08
Foreign References:
CN1505820A2004-06-16
CN109111572A2019-01-01
CN103012821A2013-04-03
CN109071811A2018-12-21
CN106497054A2017-03-15
CN108424516A2018-08-21
JP2013145280A2013-07-25
KR101357333B12014-02-04
Attorney, Agent or Firm:
KING & WOOD MALLESONS (CN)
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