Title:
PHOTOSENSITIVE POLYMER, PHOTORESIST COMPOSITION USING SAME, AND PATTERN FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/093766
Kind Code:
A2
Abstract:
Disclosed are a photosensitive polymer used in the display, semiconductor, and MEMS processes, a photoresist composition using the same, and a pattern forming method using the same. Provided is a polymer comprising a repeat unit represented by chemical formula 1, a repeat unit represented by chemical formula 2, and a repeat unit represented by chemical formula 3.
Inventors:
OH SEUNG KEUN (KR)
OH KYEONG IL (KR)
LEE CHI HWAN (KR)
PARK JOO YOUNG (KR)
KIM JAE HYUN (KR)
OH KYEONG IL (KR)
LEE CHI HWAN (KR)
PARK JOO YOUNG (KR)
KIM JAE HYUN (KR)
Application Number:
PCT/KR2018/013482
Publication Date:
May 16, 2019
Filing Date:
November 07, 2018
Export Citation:
Assignee:
DONGJIN SEMICHEM CO LTD (KR)
Attorney, Agent or Firm:
SHINWOO PATENT & LAW FIRM (KR)
Download PDF:
Previous Patent: MULTIFUNCTIONAL SUPPORTED NON-PLATINUM CATALYST FOR VEHICLE FUEL CELL AND PREPARATION METHOD THEREFO...
Next Patent: ICE BOX
Next Patent: ICE BOX