PHOTOSENSITIVE POLYMER, PHOTORESIST COMPOSITION USING SAME, AND PATTERN FORMING METHOD

Title:

PHOTOSENSITIVE POLYMER, PHOTORESIST COMPOSITION USING SAME, AND PATTERN FORMING METHOD

Document Type and Number:

WIPO Patent Application WO/2019/093766

Kind Code:

A3

Abstract:

Disclosed are a photosensitive polymer used in the display, semiconductor, and MEMS processes, a photoresist composition using the same, and a pattern forming method using the same. Provided is a polymer comprising a repeat unit represented by chemical formula 1, a repeat unit represented by chemical formula 2, and a repeat unit represented by chemical formula 3.

Inventors:

OH SEUNG KEUN (KR)
OH KYEONG IL (KR)
LEE CHI HWAN (KR)
PARK JOO YOUNG (KR)
KIM JAE HYUN (KR)

Application Number:

PCT/KR2018/013482

Publication Date:

December 19, 2019

Filing Date:

November 07, 2018

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Assignee:

DONGJIN SEMICHEM CO LTD (KR)

International Classes:

G03F7/038; C08F216/08; C08F220/04; C08F220/26; G03F7/004; G03F7/20; G03F7/26

Domestic Patent References:

WO2016208300A1

2016-12-29

Foreign References:

KR20150038180A	2015-04-08
KR20160033243A	2016-03-25
KR20140071395A	2014-06-11
KR101015613B1	2011-02-17

Attorney, Agent or Firm:

SHINWOO PATENT & LAW FIRM (KR)

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