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Title:
PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATIONS THEREOF
Document Type and Number:
WIPO Patent Application WO/2003/042758
Kind Code:
A1
Abstract:
A photosensitive resin composition comprising (a) a thermoplastic polymeric binder having an acid equivalent of 200 to 500 and a weight−average molecular weight of 30,000 to 400,000, (b) a mixture of photopolymerizable monomers each bearing at least one polymerizable ethylenically unsaturated group in the molecule which comprises (b1) a bisphenol−type photo− polymerizable monomer and (b2) a phenol−type photopolymerizable monomer and&sol or a urethane−type photopolymerizable monomer, (c) a photopolymerization initiator, and (d) Color Index Basic Green 1 (C.I. Basic Green 1).

Inventors:
MORI TORU (JP)
ADACHI TERUHIKO (JP)
Application Number:
PCT/JP2002/011744
Publication Date:
May 22, 2003
Filing Date:
November 11, 2002
Export Citation:
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Assignee:
ASAHI CHEMICAL IND (JP)
MORI TORU (JP)
ADACHI TERUHIKO (JP)
International Classes:
G03F7/027; (IPC1-7): G03F7/027; G03F7/004; H05K3/00
Foreign References:
JP2000206691A2000-07-28
JP2000181056A2000-06-30
JP2000162767A2000-06-16
JP2000214583A2000-08-04
JPH11133597A1999-05-21
JPH0990628A1997-04-04
JPH10282656A1998-10-23
JP2000356852A2000-12-26
JP2000056456A2000-02-25
JP2000275861A2000-10-06
Attorney, Agent or Firm:
Asamura, Kiyoshi (New Ohtemachi Bldg. 2-1, Ohtemachi 2-chom, Chiyoda-ku Tokyo, JP)
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