Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMING METHOD, AND LIGHT-EMITTING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2024/075581
Kind Code:
A1
Abstract:
The present invention is a photosensitive resin composition characterized: by comprising (A) a silicone resin having a phenolic hydroxyl group, (B) a photoacid generator, and (C) quantum dots; and in that the quantum dots have a surface-covering layer containing a siloxane. Due this configuration, the present invention provides: a photosensitive resin composition from which a film having high lithographic resolution and good light-emitting characteristics can easily be formed; a photosensitive resin coating and a photosensitive dry film obtained by using the photosensitive resin composition; a pattern forming method using the resin coating and the dry film; and a light-emitting element obtained by using the photosensitive resin composition.
Inventors:
MARUYAMA HITOSHI (JP)
AOKI SHINJI (JP)
NOJIMA YOSHIHIRO (JP)
TOBISHIMA KAZUYA (JP)
AOKI SHINJI (JP)
NOJIMA YOSHIHIRO (JP)
TOBISHIMA KAZUYA (JP)
Application Number:
PCT/JP2023/034820
Publication Date:
April 11, 2024
Filing Date:
September 26, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
G03F7/004; C08F2/44; C08F292/00; G02B5/20; G03F7/038; G03F7/075; H01L33/50
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
Download PDF: