Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING FILM, PATTERN FORMATION METHOD, AND LIGHT-EMITTING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2024/075586
Kind Code:
A1
Abstract:
The present invention is a photosensitive resin composition that is characterized by including (A) a resin that has a (meth)acryloyl group, (B) a photoradical generator, and (C) quantum dots that have a surface coating layer that contains a siloxane. The present invention thereby provides a photosensitive resin composition that makes it possible to easily form a coating film that has high lithography resolution and favorable light emission characteristics, a photosensitive resin coating film obtained using the photosensitive resin composition, a pattern formation method that uses the photosensitive resin composition and the photosensitive resin coating film, and a light-emitting element obtained using the photosensitive resin composition.
Inventors:
MARUYAMA HITOSHI (JP)
AOKI SHINJI (JP)
NOJIMA YOSHIHIRO (JP)
TOBISHIMA KAZUYA (JP)
AOKI SHINJI (JP)
NOJIMA YOSHIHIRO (JP)
TOBISHIMA KAZUYA (JP)
Application Number:
PCT/JP2023/034849
Publication Date:
April 11, 2024
Filing Date:
September 26, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
G03F7/075; C09K11/08; G02B5/20; G03F7/004; G03F7/027; G03F7/20
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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