Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED ARTICLE, ORGANIC EL DISPLAY DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING CURED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/095785
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a photosensitive resin composition that has high sensitivity, can be formed into a cured article having high bending resistance, and can achieve high reliability when the cured article is used in an organic EL display device. The photosensitive resin composition comprises (A) an alkali-soluble resin, (B) a quinonediazide compound, (C) a thermal crosslinking agent, and (D) a thermal acid generator, in which the thermal crosslinking agent (C) comprises (C1) a thermal crosslinking agent having a phenolic hydroxyl group and also having a methylol group and/or an alkoxymethyl group in the molecule thereof and (C2) a thermal crosslinking agent having an epoxy group.
Inventors:
IKEDA KEI (JP)
KAMEMOTO SATOSHI (JP)
ONIKI JUMPEI (JP)
KAMEMOTO SATOSHI (JP)
ONIKI JUMPEI (JP)
Application Number:
PCT/JP2022/043165
Publication Date:
June 01, 2023
Filing Date:
November 22, 2022
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/004; C08K5/13; C08K5/23; C08L63/00; C08L79/04; G03F7/023; G09F9/00; G09F9/30; H05B33/10; H05B33/12; H05B33/22; H10K50/00; H10K59/00
Foreign References:
| JP2020177052A | 2020-10-29 | |||
| JP2019070832A | 2019-05-09 | |||
| JP2020056844A | 2020-04-09 | |||
| JP2022029198A | 2022-02-17 |
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