Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING LAMINATE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/131037
Kind Code:
A1
Abstract:
Provided are a photosensitive resin composition having superior adhesiveness, a cured film using same, a laminate, a method for manufacturing a cured film, a method for manufacturing a laminate, and a semiconductor device. The resin composition comprises a polyimide precursor, at least one type of polyimide resin, and at least one type of urethane (meth)acrylate. The urethane (meth)acrylate has a moiety structure represented by formula (A) and/or a moiety structure represented by formula (B), 4 to 15 (meth)acrylate groups, and a urethane structure. Note that the symbol * in the formulas represents a linking arm.
Inventors:
IWAI YU (JP)
KAWABATA TAKESHI (JP)
SHIBUYA AKINORI (JP)
KAWABATA TAKESHI (JP)
SHIBUYA AKINORI (JP)
Application Number:
PCT/JP2017/002563
Publication Date:
August 03, 2017
Filing Date:
January 25, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/027; C08F2/48; C08F299/06; G03F7/004; G03F7/031; G03F7/20; G03F7/40; C07C235/84
Domestic Patent References:
| WO2015072532A1 | 2015-05-21 |
Foreign References:
| JP2008197160A | 2008-08-28 | |||
| JP2001005181A | 2001-01-12 | |||
| JPH1124257A | 1999-01-29 | |||
| JP2012198361A | 2012-10-18 | |||
| JP2006071783A | 2006-03-16 | |||
| JP2011186398A | 2011-09-22 | |||
| JPH1048822A | 1998-02-20 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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