PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM PREPARED THEREFROM

WIPO Patent Application WO/2018/034460

A1

The present invention relates to a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition additionally includes a thermal acid generator in addition to a conventional siloxane polymer, and an 1,2-quinonediazide compound, and a hydrogen bond between the diazonaphthoquinone group (DNQ) of the quinonediazide compound and the siloxane polymer may be cleaved by an acid generated from the thermal acid generator even if a photobleaching process is not performed during the preparation of a cured film. Accordingly, when the photosensitive resin composition is used a cured film having high transmittance and high resolution may be provided efficiently without any restrictions on a process equipment. In addition, the increase of the transmittance of the cured film may be maximized when acid groups generated from the thermal acid generator is a strong acid having a pKa value of -5 or less.

JP2002341521	RADIATION SENSITIVE RESIN COMPOSITION
JPH0486665	RADIATION SENSITIVE RESIN COMPOSITION
JP2001337456	POSITIVE PHOTORESIST COMPOSITION

NA JONG HO (KR)
HUH GEUN (KR)
KWON JIN (KR)
YANG JONG HAN (KR)

PCT/KR2017/008679

February 22, 2018

August 10, 2017

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ROHM & HAAS ELECT MATERIALS KOREA LTD (KR)

G03F7/022; G03F1/48; G03F7/021; G03F7/039; G03F7/16; G03F7/20; H01L51/00

WO2009111122A2	2009-09-11
WO2007118024A1	2007-10-18

US20070172759A1	2007-07-26
US20110008730A1	2011-01-13
KR20130113635A	2013-10-16

FIRSTLAW P.C. (KR)

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