PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM AND PRODUCTION METHOD THEREFOR, AND ELECTRONIC COMPONENT

Title:

PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM AND PRODUCTION METHOD THEREFOR, AND ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2018/150771

Kind Code:

A1

Abstract:

[Problem] To simultaneously achieve chemical resistance and crack resistance in a cured film obtained from a photosensitive resin composition comprising a phenolic hydroxyl-containing resin as an alkali-soluble resin. [Solution] This photosensitive resin composition comprises a phenolic hydroxyl-containing resin (A), a photoacid generating agent (B), and a maleimide group-containing compound (C).

Inventors:

KANNO KIMIYUKI (JP)
YAMAGUCHI TORAHIKO (JP)
TATARA RYOUJI (JP)

Application Number:

PCT/JP2018/000642

Publication Date:

August 23, 2018

Filing Date:

January 12, 2018

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Assignee:

JSR CORP (JP)

International Classes:

C08F8/30; G03F7/004; C08G83/00; G03F7/023; G03F7/20

Foreign References:

JP2013190698A	2013-09-26
JP2013190689A	2013-09-26
JP2015145912A	2015-08-13
JP2009222923A	2009-10-01
JPH05257273A	1993-10-08
JP2017129768A	2017-07-27

Attorney, Agent or Firm:

SSINPAT PATENT FIRM (JP)

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