Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/181182
Kind Code:
A1
Abstract:
Provided are: a photosensitive resin composition which enables the achievement of a cured film that has a small warp after curing, and which exhibits excellent lithographic properties during the formation of a pattern; a cured film; a laminate; a method for producing a cured film; and a semiconductor device. A photosensitive resin composition which contains: a polyimide precursor that contains a repeating unit containing a biphenyl structure; and a photopolymerization initiator that has an oxime structure which is capable of generating an aryl radical upon irradiation of light.
Inventors:
FUKUHARA KEI (JP)
IWAI YU (JP)
IWAI YU (JP)
Application Number:
PCT/JP2018/012140
Publication Date:
October 04, 2018
Filing Date:
March 26, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/037; B32B27/34; C08G73/10; G03F7/027; G03F7/031; G03F7/20
Domestic Patent References:
| WO2017038598A1 | 2017-03-09 | |||
| WO2017033833A1 | 2017-03-02 | |||
| WO2015011893A1 | 2015-01-29 |
Foreign References:
| JP2015113429A | 2015-06-22 | |||
| JP2003345012A | 2003-12-03 | |||
| JP2010266843A | 2010-11-25 | |||
| JP2015151405A | 2015-08-24 | |||
| JP2015127817A | 2015-07-09 | |||
| JP2001254014A | 2001-09-18 | |||
| JP2011164454A | 2011-08-25 | |||
| JP2014122279A | 2014-07-03 | |||
| JP2014145957A | 2014-08-14 | |||
| JP2009251451A | 2009-10-29 | |||
| JP2001194783A | 2001-07-19 | |||
| JP2011059656A | 2011-03-24 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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