Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAYERED PRODUCT, PRODUCTION METHOD FOR CURED FILM, SEMICONDUCTOR DEVICE, AND THERMAL BASE GENERATOR
Document Type and Number:
WIPO Patent Application WO/2020/066244
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition having excellent curability and storage stability. Also, provided are: a cured film employing the photosensitive resin composition; a layered product; a production method for a cured film; and a semiconductor device. This photosensitive resin composition comprises a thermal base generator represented by formula (N1), and at least one precursor compound of polyimide precursors and polybenzoxazole precursors. In formula (N1), XN represents one of a hydroxy group, a carboxyl group, and a sulfonate group, ZN represents an oxygen atom or a sulfur atom, LN represents a hydrocarbon group linking together adjacent nitrogen atoms and XN, and the number of atoms constituting the linking chain is 2-6.
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Inventors:
NOZAKI ATSUYASU (JP)
Application Number:
PCT/JP2019/028671
Publication Date:
April 02, 2020
Filing Date:
July 22, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C08F290/14; G03F7/027
Foreign References:
| JP2010139860A | 2010-06-24 | |||
| JP2013068681A | 2013-04-18 | |||
| JP2016050259A | 2016-04-11 | |||
| JP2013241548A | 2013-12-05 | |||
| US20120157652A1 | 2012-06-21 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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