Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/172988
Kind Code:
A1
Abstract:
A photosensitive resin composition of the present invention comprises: a polymer A having a constituent unit represented by general formula (a) below; and a polymer B containing a polyimide having a group b represented by general formula (b) below.
Inventors:
OTOGURO AKIHIKO (JP)
IMAI KEITA (JP)
UEDA YUKI (JP)
KUBOYAMA TOSHIHARU (JP)
IMAI KEITA (JP)
UEDA YUKI (JP)
KUBOYAMA TOSHIHARU (JP)
Application Number:
PCT/JP2022/005338
Publication Date:
August 18, 2022
Filing Date:
February 10, 2022
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08F32/00; C08G73/10; C08G73/12; C08G73/16; G03F7/027; G03F7/028; G03F7/033; G03F7/037; G03F7/075
Foreign References:
| JP2015523708A | 2015-08-13 | |||
| JP2016503580A | 2016-02-04 | |||
| JP2000267110A | 2000-09-29 | |||
| US4578328A | 1986-03-25 | |||
| JP2017049382A | 2017-03-09 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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