Title:
PHOTOSENSITIVE RESIN COMPOSITION, AND CURED-PATTERN-FILM MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE USING SAID PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/097595
Kind Code:
A1
Abstract:
A resin composition containing the following components: (a) a polyimide precursor having a structural unit that can be represented by general formula (1) (in which A represents one of the tetravalent organic groups represented by formulas (2a) to (2d) and B represents a divalent organic group that can be represented by general formula (3)); (b) an oxime-ester compound; and (c) a solvent.
Inventors:
ENOMOTO TETSUYA (JP)
ONO KEISHI (JP)
OHE MASAYUKI (JP)
SUZUKI KEIKO (JP)
SOEJIMA KAZUYA (JP)
SUZUKI ETSUHARU (JP)
ONO KEISHI (JP)
OHE MASAYUKI (JP)
SUZUKI KEIKO (JP)
SOEJIMA KAZUYA (JP)
SUZUKI ETSUHARU (JP)
Application Number:
PCT/JP2013/007347
Publication Date:
June 26, 2014
Filing Date:
December 13, 2013
Export Citation:
Assignee:
HITACHI CHEM DUPONT MICROSYS (JP)
International Classes:
C08G73/10; C08F290/14; C08L79/04; G03F7/027; G03F7/031; H01L21/027
Foreign References:
| JP2010266843A | 2010-11-25 | |||
| JP2003345012A | 2003-12-03 | |||
| JP2008076583A | 2008-04-03 | |||
| JP2003209104A | 2003-07-25 | |||
| JP2003255535A | 2003-09-10 | |||
| JP2002037886A | 2002-02-06 | |||
| JP2001305749A | 2001-11-02 | |||
| JPH07304871A | 1995-11-21 |
Attorney, Agent or Firm:
WATANABE, Kihei et al. (JP)
Kihei Watanabe (JP)
Kihei Watanabe (JP)
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