Title:
PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2016/121706
Kind Code:
A1
Abstract:
Provided is a resin composition that has a low shrinkage ratio when cured and provides a cured film having a reduced occurrence of outgas during a bonding process or after curing, and having excellent flexibility in addition to having excellent weatherability and light resistance. The photosensitive resin composition (D) contains a self-polymerization type photopolymerizable compound (A) represented by general formula (1), a urethane (meth)acrylate compound (B), and a polymerizable compound (C) other than (B). (In the formula, R represents a hydrogen atom or a methyl group.)
Inventors:
KAMETANI HIDEAKI (JP)
IIZUKA MASAYUKI (JP)
MOTOHASHI HAYATO (JP)
MIZUGUCHI TAKAFUMI (JP)
IIZUKA MASAYUKI (JP)
MOTOHASHI HAYATO (JP)
MIZUGUCHI TAKAFUMI (JP)
Application Number:
PCT/JP2016/052048
Publication Date:
August 04, 2016
Filing Date:
January 25, 2016
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08F290/06; C08F2/48; C09J4/02; C09J11/00; C09J175/16
Domestic Patent References:
| WO2006027982A1 | 2006-03-16 | |||
| WO2006038547A1 | 2006-04-13 |
Foreign References:
| JP2013025177A | 2013-02-04 | |||
| JP2007010769A | 2007-01-18 | |||
| JP2009001730A | 2009-01-08 | |||
| JP2010215769A | 2010-09-30 | |||
| JP2009242733A | 2009-10-22 |
Attorney, Agent or Firm:
Shin-Ei Patent Firm, P. C. (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
Download PDF:
Previous Patent: BIDIRECTIONAL DC-DC CONVERTER, POWER CONDITIONER, AND DISPERSED POWER SUPPLY SYSTEM
Next Patent: METHOD FOR CONTROLLING PLANT GROWTH
Next Patent: METHOD FOR CONTROLLING PLANT GROWTH