Title:
PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT THEREFROM
Document Type and Number:
WIPO Patent Application WO/2018/194154
Kind Code:
A1
Abstract:
The present invention is a negative-acting photosensitive resin composition including (A) a compound having a triazine ring and represented by formula (1) (in formula (1), each R1 independently represents an organic group, wherein at least one R1 represents an organic group having a glycidyl group or an organic group having an oxetanyl group), (B) an epoxy resin having in each molecule a benzene skeleton and at least two epoxy groups and having an epoxy equivalent weight of not more than 500 g/eq., and (C) a cationic photopolymerization initiator. The content of the (A) compound represented by formula (1) with reference to the (B) epoxy resin is 1 to 50 mass%. The (B) epoxy resin satisfies at least one of the following conditions (i) and (ii): condition (i) a weight-average molecular weight of at least 500, and condition (ii) a softening point of at least 40°C.
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Inventors:
HAKONE YOSHIHIRO (JP)
KOUMOTO TAIHEI (JP)
KOUMOTO TAIHEI (JP)
Application Number:
PCT/JP2018/016265
Publication Date:
October 25, 2018
Filing Date:
April 20, 2018
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
G03F7/038; C08G59/20; G03F7/004
Domestic Patent References:
| WO2012008472A1 | 2012-01-19 | |||
| WO2018043395A1 | 2018-03-08 |
Foreign References:
| JP2000122287A | 2000-04-28 | |||
| JP2002161196A | 2002-06-04 | |||
| JP2007506137A | 2007-03-15 |
Attorney, Agent or Firm:
ASAMURA PATENT OFFICE, P.C. (JP)
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