Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESISTS AND RESIST MEMBER
Document Type and Number:
WIPO Patent Application WO/2019/198490
Kind Code:
A1
Abstract:
Provided are: a photosensitive resin composition comprising an acid group-containing (meth)acrylate resin (A) and a photopolymerization initiator (B), characterized in that the photopolymerization initiator (B) is a compound represented by general formula (1); a cured product that is a product of a curing reaction of the photosensitive resin composition; an insulating material; a resin material for solder resists; and a resist member. The photosensitive resin composition has a high photosensitivity and is capable of forming a cured product that has an excellent heat tolerance and generates little outgas.
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Inventors:
MIYAMOTO MASANORI (JP)
YAMADA SHUNSUKE (JP)
YAMADA SHUNSUKE (JP)
Application Number:
PCT/JP2019/012753
Publication Date:
October 17, 2019
Filing Date:
March 26, 2019
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
G03F7/031; C08F2/50; C08F290/00; G03F7/027; H05K3/28
Domestic Patent References:
| WO2012023164A1 | 2012-02-23 | |||
| WO2017195428A1 | 2017-11-16 |
Foreign References:
| JP2005314634A | 2005-11-10 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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