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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION AND DIELECTRIC FILM FORMED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2019/164162
Kind Code:
A1
Abstract:
A photosensitive resin composition of embodiments of the present invention comprises a polybenzoxazole precursor, a sensitizer and a solvent mixture. The solvent mixture comprises, on the basis of 100 parts by weight of the solvent mixture, 25-45 parts by weight of a first solvent having a boiling point of 100-140°C, 35-65 parts by weight of a second solvent having a boiling point of 140-160°C, and 10-30 parts by weight of a third solvent having a boiling point of 160-200°C. A dielectric film having reduced drying-induced stains can be formed by using the photosensitive resin composition.

Inventors:
CHOI, Han Young (302-402, 33 Segyogongwon-ro,,Pyeongtaek-si, Gyeonggi-do, 17834, KR)
KO, Kyung Jun (104-1206, 51Gobong-ro30-gil,,Iksan-si, Jeollabuk-do, 54637, KR)
KIM, Sung Sik (#201, 67-1Seogok-ro,Wansan-gu,,Jeonju-si, Jeollabuk-do, 54956, KR)
KUM, Joong Han (104-206, 103 Banchon-ro, Songak-eup,,Dangjin-si, Chungcheongnam-do, 31733, KR)
KIM, Jeong Hyun (1-201, 494 Seodong-ro,,Iksan-si, Jeollabuk-do, 54590, KR)
YANG, Don Sik (502-301, 35 Gobong-ro 34-gil,,Iksan-si, Jeollabuk-do, 54544, KR)
Application Number:
KR2019/001603
Publication Date:
August 29, 2019
Filing Date:
February 11, 2019
Export Citation:
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Assignee:
DONGWOO FINE-CHEM CO., LTD. (132 Yakchon-ro, Iksan-si, Jeollabuk-do, 54631, KR)
International Classes:
G03F7/004; H01L21/31
Attorney, Agent or Firm:
LEECHAE INTELLECTUAL PROPERTY (3F 12, Teheran-ro 26-gil,Gangnam-gu, Seoul, 06236, KR)
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