Title:
PHOTOSENSITIVE RESIN COMPOSITION AND DIELECTRIC FILM FORMED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2019/164162
Kind Code:
A1
Abstract:
A photosensitive resin composition of embodiments of the present invention comprises a polybenzoxazole precursor, a sensitizer and a solvent mixture. The solvent mixture comprises, on the basis of 100 parts by weight of the solvent mixture, 25-45 parts by weight of a first solvent having a boiling point of 100-140°C, 35-65 parts by weight of a second solvent having a boiling point of 140-160°C, and 10-30 parts by weight of a third solvent having a boiling point of 160-200°C. A dielectric film having reduced drying-induced stains can be formed by using the photosensitive resin composition.
Inventors:
CHOI HAN YOUNG (KR)
KO KYUNG JUN (KR)
KIM SUNG SIK (KR)
KUM JOONG HAN (KR)
KIM JEONG HYUN (KR)
YANG DON SIK (KR)
KO KYUNG JUN (KR)
KIM SUNG SIK (KR)
KUM JOONG HAN (KR)
KIM JEONG HYUN (KR)
YANG DON SIK (KR)
Application Number:
PCT/KR2019/001603
Publication Date:
August 29, 2019
Filing Date:
February 11, 2019
Export Citation:
Assignee:
DONGWOO FINE CHEM CO LTD (KR)
International Classes:
G03F7/004; H01L21/31
Domestic Patent References:
| WO2015087832A1 | 2015-06-18 |
Foreign References:
| JP2014162818A | 2014-09-08 | |||
| KR20150037400A | 2015-04-08 | |||
| KR20120028406A | 2012-03-22 | |||
| JP2017040760A | 2017-02-23 |
Attorney, Agent or Firm:
LEECHAE INTELLECTUAL PROPERTY (KR)
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