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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION AND DIELECTRIC FILM FORMED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2019/164162
Kind Code:
A1
Abstract:
A photosensitive resin composition of embodiments of the present invention comprises a polybenzoxazole precursor, a sensitizer and a solvent mixture. The solvent mixture comprises, on the basis of 100 parts by weight of the solvent mixture, 25-45 parts by weight of a first solvent having a boiling point of 100-140°C, 35-65 parts by weight of a second solvent having a boiling point of 140-160°C, and 10-30 parts by weight of a third solvent having a boiling point of 160-200°C. A dielectric film having reduced drying-induced stains can be formed by using the photosensitive resin composition.

Inventors:
CHOI HAN YOUNG (KR)
KO KYUNG JUN (KR)
KIM SUNG SIK (KR)
KUM JOONG HAN (KR)
KIM JEONG HYUN (KR)
YANG DON SIK (KR)
Application Number:
KR2019/001603
Publication Date:
August 29, 2019
Filing Date:
February 11, 2019
Export Citation:
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Assignee:
DONGWOO FINE CHEM CO LTD (KR)
International Classes:
G03F7/004; H01L21/31
Domestic Patent References:
WO2015087832A12015-06-18
Foreign References:
JP2014162818A2014-09-08
KR20150037400A2015-04-08
KR20120028406A2012-03-22
JP2017040760A2017-02-23
Attorney, Agent or Firm:
LEECHAE INTELLECTUAL PROPERTY (KR)
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