Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/081131
Kind Code:
A1
Abstract:
Disclosed is a photosensitive resin composition, which contains: a vinyl polymer (I) that is obtained by polymerizing a monomer mixture that contains a monomer (a) having a phenolic hydroxyl group; a vinyl polymer (II) that has a mass average molecular weight of 20,000-100,000 and is obtained by polymerizing a monomer mixture that contains a carboxyl group-containing vinyl monomer (b) (provided that the vinyl polymer (I) is excluded); a quinonediazide compound (III); and a compound (IV) represented by formula (5). (In the formula, Y represents a hydrocarbon group having 1-6 carbon atoms; l and m each represents an integer of 1-3; n represents 1 or 2; and p and q each represents 0 or 1.)
Inventors:
UEDA AKIFUMI (JP)
NAKAGAWARA HIDETAKA (JP)
WATANABE KAZUO (JP)
WATANABE SHIGEKI (JP)
LAN WEN JEN
LIN CHAO WEN
NAKAGAWARA HIDETAKA (JP)
WATANABE KAZUO (JP)
WATANABE SHIGEKI (JP)
LAN WEN JEN
LIN CHAO WEN
Application Number:
PCT/JP2010/073532
Publication Date:
July 07, 2011
Filing Date:
December 27, 2010
Export Citation:
Assignee:
MICRO PROCESS INC (JP)
EVERLIGHT CHEM IND CORP
MITSUBISHI RAYON CO (JP)
UEDA AKIFUMI (JP)
NAKAGAWARA HIDETAKA (JP)
WATANABE KAZUO (JP)
WATANABE SHIGEKI (JP)
LAN WEN JEN
LIN CHAO WEN
EVERLIGHT CHEM IND CORP
MITSUBISHI RAYON CO (JP)
UEDA AKIFUMI (JP)
NAKAGAWARA HIDETAKA (JP)
WATANABE KAZUO (JP)
WATANABE SHIGEKI (JP)
LAN WEN JEN
LIN CHAO WEN
International Classes:
G03F7/023; G03F7/004; G03F7/022; H05K3/06; H05K3/18
Foreign References:
| JPH07133449A | 1995-05-23 | |||
| JPH01280748A | 1989-11-10 | |||
| JP2009282512A | 2009-12-03 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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