Title:
PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2017/122744
Kind Code:
A1
Abstract:
Provided are a photosensitive resin composition having excellent resolution, a dry film having a resin layer obtained from the composition, a cured product of the composition or the resin layer of the dry film, and a printed wiring board having the cured product. The photosensitive resin composition contains (A) a polyamic acid ester and (B) a photobase generator, the photosensitive resin composition, etc. being characterized in that the (A) a polyamic acid ester has a structure represented by general formula (1). (In formula (1), R1 is a tetravalent organic group; R2 is either a group having an alicyclic skeleton, a phenylene group, a group having a bisphenylene skeleton bonded with an alkylene group, or an alkylene group; X is a bivalent organic group; R3 and R4 may be the same or different from each other and are each either a monovalent organic group or a functional group having silicon; m is an integer of 1 or greater; and n is 0 or an integer of 1 or greater.)
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Inventors:
GUO YANGMEI (JP)
MIWA TAKAO (JP)
OKAYASU KATSUKI (JP)
MIWA TAKAO (JP)
OKAYASU KATSUKI (JP)
Application Number:
PCT/JP2017/000876
Publication Date:
July 20, 2017
Filing Date:
January 12, 2017
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
International Classes:
G03F7/038; G03F7/004; H05K3/28
Domestic Patent References:
| WO2015019802A1 | 2015-02-12 |
Foreign References:
| JPH05197148A | 1993-08-06 | |||
| JP2001019847A | 2001-01-23 | |||
| JP2007101685A | 2007-04-19 | |||
| JP2010186134A | 2010-08-26 | |||
| JP2015141303A | 2015-08-03 | |||
| JP2003084435A | 2003-03-19 | |||
| JP2004077553A | 2004-03-11 | |||
| JP2009265637A | 2009-11-12 | |||
| JP2016130836A | 2016-07-21 |
Attorney, Agent or Firm:
HONDA Ichiro (JP)
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